ALSIC
T-GLOBAL TECHNOLOGY CO., LTD.
ALSIC
T-GLOBAL TECHNOLOGY CO., LTD.
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T-Global Technology is committed to advancing thermal management materials through innovative solutions.
AlSiC, a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional Metal Matrix Composites, AlSiC offers superior structural stability and optimized material properties.
While its thermal conductivity is slightly lower than copper, AlSiC’s density is only one-third that of copper, enabling lightweight designs. Its high rigidity makes it resistant to deformation, while its low thermal expansion properties enhance reliability. With over 99% infiltration efficiency, aluminum is uniformly embedded within the SiC matrix, ensuring outstanding performance.
AlSiC is widely applied in IGBT baseplates, semiconductor packaging, CoWoS rings, and stages, serving industries such as electric vehicles, semiconductors, 5G and AI packaging, high-performance computing, green energy, and aerospace.
Through advanced production technologies, T-Global ensures that AlSiC delivers exceptional stability and reliability in demanding environments, meeting diverse market needs.
Highlights
- AlSiC has Excellent Thermal Expansion Coefficient Matching. The thermal expansion coefficient of AlSiC products is very close to commonly used substrates and chips, such as AIN or Al2O3, or Si Chip, which is conducive to the thermal stability of AlSiC used in IGBT high-power modules and IC chip packaging.
- AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost.
- AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation.
- The AlSiC material has covalently bonded SiC ceramic particles therein, so it has high bending strength which can be applied for the reflow or high thermal shock process, and high elastic modulus, high toughness and wear resistance.
- It is lightweight and can be thinned, and can be used in electronic component thermal management, automotive industry, high-precision machinery, green energy industry, aerospace industry and other military fields.
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Back to Hall of Fame
T-Global Technology is committed to advancing thermal management materials through innovative solutions.
AlSiC, a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional Metal Matrix Composites, AlSiC offers superior structural stability and optimized material properties.
While its thermal conductivity is slightly lower than copper, AlSiC’s density is only one-third that of copper, enabling lightweight designs. Its high rigidity makes it resistant to deformation, while its low thermal expansion properties enhance reliability. With over 99% infiltration efficiency, aluminum is uniformly embedded within the SiC matrix, ensuring outstanding performance.
AlSiC is widely applied in IGBT baseplates, semiconductor packaging, CoWoS rings, and stages, serving industries such as electric vehicles, semiconductors, 5G and AI packaging, high-performance computing, green energy, and aerospace.
Through advanced production technologies, T-Global ensures that AlSiC delivers exceptional stability and reliability in demanding environments, meeting diverse market needs.
Highlights
- AlSiC has Excellent Thermal Expansion Coefficient Matching. The thermal expansion coefficient of AlSiC products is very close to commonly used substrates and chips, such as AIN or Al2O3, or Si Chip, which is conducive to the thermal stability of AlSiC used in IGBT high-power modules and IC chip packaging.
- AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost.
- AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation.
- The AlSiC material has covalently bonded SiC ceramic particles therein, so it has high bending strength which can be applied for the reflow or high thermal shock process, and high elastic modulus, high toughness and wear resistance.
- It is lightweight and can be thinned, and can be used in electronic component thermal management, automotive industry, high-precision machinery, green energy industry, aerospace industry and other military fields.